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Gaurav Mehrotra

Packaging Engineer

Packaging Technologist | OSAT Management | NPI

San Jose, California

Section title

Gaurav Mehrotra's Email Addresses & Phone Numbers

Gaurav Mehrotra's Work Experience


Packaging Engineer

March 2008 to April 2010

Milpitas, CA

IDT - Integrated Device Technology, Inc.(acquired by Renesas)

Principal Package Development Engineer

San Jose, California, United States

IDT - Integrated Device Technology, Inc.(acquired by Renesas)

Staff Package Development Engineer

October 2012 to April 2017

Gaurav Mehrotra's Education

Georgia Institute of Technology

MS, Materials Science & Engineering

Indian Institute of Technology, Kanpur

B.Tech, Materials & Metallurgical Engineering

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Gaurav Mehrotra's Estimated Salary Range

About Gaurav Mehrotra's Current Company


Frequently Asked Questions about Gaurav Mehrotra

What company does Gaurav Mehrotra work for?

Gaurav Mehrotra works for Intersil

What is Gaurav Mehrotra's role at Intersil?

Gaurav Mehrotra is Packaging Engineer

What is Gaurav Mehrotra's personal email address?

Gaurav Mehrotra's personal email address is g****[email protected]

What is Gaurav Mehrotra's business email address?

Gaurav Mehrotra's business email addresses are not available

What is Gaurav Mehrotra's Phone Number?

Gaurav Mehrotra's phone (213) ***-*245

What industry does Gaurav Mehrotra work in?

Gaurav Mehrotra works in the Semiconductors industry.

About Gaurav Mehrotra

📖 Summary

Packaging Engineer @ Intersil From March 2008 to April 2010 (2 years 2 months) Milpitas, CAPrincipal Package Development Engineer @ IDT - Integrated Device Technology, Inc.(acquired by Renesas) FCCSP, SiP & heterogeneous integration for RF/mmWave/5G, Optical sensor/ biosensor SiP, MEMS & thermopile sensor, implantable continuous glucose monitoring sensor (Eversenseâ„¢) San Jose, California, United StatesStaff Package Development Engineer @ IDT - Integrated Device Technology, Inc.(acquired by Renesas) WLCSP; Delivered 10+ products with 400Mu+ shipped to top three phone makers From October 2012 to April 2017 (4 years 7 months) Member of Technical Staff @ Maxim Integrated Products Exposed die flip chip QFN, proximity/gesture sensor co-package with integrated LED From March 2011 to October 2012 (1 year 8 months) San Jose, California, United StatesSr. Packaging Engineer @ Intersil Cu wire bonding development and ramp up on multiple fab processes at top 3 OSATs From May 2010 to March 2011 (11 months) Graduate Research Assisstant @ 3D Systems Packaging Research Center @ Georgia Tech 30um pitch Cu Pillar flip-chip fabrication, assembly, & reliability From August 2005 to March 2008 (2 years 8 months) Summer Intern @ Rohm and Haas Electronic Materials SnAg plating process development to minimize voiding during reflow From June 2006 to August 2006 (3 months) Materials Engineer @ Tata Motors Material selection and mechanical testing for engine block material for TATA Nano From 2004 to 2005 (1 year) Pune Area, India

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In a nutshell

Gaurav Mehrotra's Personality Type

Introversion (I), Intuition (N), Thinking (T), Judging (J)

Average Tenure

1 year(s), 10 month(s)

Gaurav Mehrotra's Willingness to Change Jobs



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