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51-200 employees
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semiconductors
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US
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The alteration and testing of microelectronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance. Services include: robotic hot solder dip, column attach, ball grid array (BGA) to column grid array (CGA) conversions, ball attach, BGA reballing, and trim & form. Testing includes: solderability, fine & gross leak, bond pull, ball shear, XRF, failure analysis, and mark permanency. Products include BGA preforms for ball attach or reballing.
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Six Sigma Email Formats | Example Email Formats | Percentage |
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{f}{last} | [email protected] |
75.00%
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The widely used Six Sigma email format is {f}{last} (e.g. [email protected]) with 75.00% adoption across the company.
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