Deca Technologies

Deca Technologies is an electronic interconnect solutions provider that offers wafer level chip scale packaging (WLCSP) and Fan-out wafer level packaging (FOWLP) services to the semiconductor industry. Integrating solar and semiconductor technology, we leverage unique equipment, processes and operational methods to address some of the significant barriers to the continued adoption and growth of next generation interconnects. Our portfolio of proprietary, game-changing electronic interconnect solutions deliver leadership capabilities in performance, cost and technology allied to a flexible manufacturing process that enables 200mm and 300mm wafers to be managed simultaneously. Deca’s process significantly reduces cycle time and permits multiple design iterations with minimal investment, thereby enabling the adoption of wafer level interconnect technologies for a wide array of semiconductor device types.