Iceotope Technologies Limited

RECLAIM POWER, BOOST PERFORMANCE, MAXIMISE SPACE AND SAVE MONEY Our patented chassis level liquid cooling technology with precision delivery of a dielectric coolant can easily accommodate the increasing heat loads from the latest processor roadmaps – from relatively modest densities through to 45kw per rack. But if it’s Formula 1 compute, networking and storage you’re looking for, we’ve already cooled 100kw per rack. Dealing with heat at source and managing it effectively, our cooling technology has 1000 times** the capacity to remove heat from electronics than air-cooling. Adding more cooling capacity our technology enables processors to be configured for higher power envelopes, whilst maintaining run at higher performance levels. By removing the need for and the restrictions created by complex air-cooling infra-structure, our cooling technology can use 5 times* less energy, 75%* less space, and contribute to significant water savings. Because the servers are 100% sealed, protected, resilient and thermally stable over a wide range of operating temperatures, they can be deployed in the harshest environments. Our cooling technology not only offers a CapEx saving of 30%* and an OpEx saving of 70%*, it also helps reclaim power capacity, boost IT performance, reduce failure risk, and simplify the data centre.