Songhan Zhang's Email

Passionate, hard-working, enthusiasm

Financial Software Engineer @ From April, 2015 - June, 2015, Work for Bloomberg TradeBook LLC @ Equity Clearing Team From Oct, 2015 - Now, Work for Bloomberg LP @ Trade Order Management Solutions Core Traders/Sales Team. From April 2015 to Present (9 months) Greater New York City AreaIndustry Department Intern @ Analyzed TD chip manufacturers both in China and the world, focusing on the comparison between their baseband chips, radio frequency chips and User Equipment. Drafted speech for general secretary and the director of industry department on 3GPP standardization summit in China and worked as a service staff in the conference. Wrote reports for Ministry of industry and information technology about plan for future development of TD chip in China, suggesting that decreasing the size of chip, supporting multi-mode multi-band and lowering the energy consumption are the next focus points. From October 2012 to May 2013 (8 months) Beijing City, China

Master of Science (MSc), Electrical and Electronics Engineering @ Columbia University in the City of New York From 2013 to 2014 Bachelor of Applied Science (BASc), Telecommunications Engineering @ Beijing University of Post and Telecommunications From 2009 to 2013 Bachelor of Applied Science (B.A.Sc.), Telecommunications Engineering with Management, First Class @ Queen Mary, U. of London From 2009 to 2013 Songhan Zhang is skilled in: C, Algorithms, Matlab, Java, Data Structures, C++, RF