Cheung Lo’s Email & Phone

Cheung Lo Contact Details

Location:
Philadelphia, Pennsylvania
Work:
Associate Engineer @ Teleflex
Biomaterials Engineering Intern @ Synthes
Mechanical Engineering Intern @ DCMA Boeing Philadelphia
Education:
Bachelor of Science (B.S.), Mechanical Engineering, 16 Credits @ KTH Royal Institute of Technology
About:

Associate Engineer @ From August 2014 to Present (1 year 5 months) Reading, Pennsylvania AreaBiomaterials Engineering Intern @ ► Formulated a new bioceramic paste product to help treat bone defects and voids ► Implemented an innovative bone paste dispenser mechanism to increase the consistency of the paste and potentially improve patient care ► Devised an improved test 

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