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Zhibin Xie

Staff QA engineer @ STATS ChipPAC

Zhibin Xie Contact Details

Staff QA engineer @ STATS ChipPAC
Senior Product Development Engineer @ AMD
Research Fellow @ National University of Singapore
B. Engi, Materials Science & Engineering @ Beijing University of Aeronautics & Astronautics

• ~3 year experience in Failure Analysis (FA) for both package & die levels with extensive hands-on experience and solid background in electrical & physical failure analysis techniques. • ~10 years research experience in thin film fabrication & nanomaterials synthesis, micro-structural characterization, devices physics for solar cells and LEDs. • Ph.D. in Materials Science from University of 

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