Yaodong Wang’s Email & Phone

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Yaodong Wang

Packaging R&D Engineer @ Intel Corporation

Yaodong Wang Contact Details

Location:
Phoenix, Arizona Area
Work:
Packaging R&D Engineer @ Intel Corporation
Ph.D. Candidate at Department of Materials Science and Engineering @ UCLA
Supply Chain Quality (Manufacturing/ System Reliability engineering Internship) @ Hewlett-Packard
Education:
Master of Materials Engineering, Electronic Materials @ University of California, Los Angeles
About:

Currently looking for internship in 2015 and full time position in 2016 both on hardware engineering. I am a well-trained materials and device engineer with 6 years experience in metals, semiconductors and ceramic materials. I am specializing in materials selection and design, microstructure control and failure and reliability analysis. My current research interest is on mechanical reliability 

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