Vice President of Engineering and Operations @ BEAM Authentic
Vice President of Hardware Engineering and Operations @ Lytro Inc.
Vice President of Engineering @ Working with an awesome team to build a new tech company which is developing a new line of wearable devices and a dynamic platform for the mass market which will create an entirely new category in consumer electronics. From November 2015 to Present (2 months) San Francisco Bay AreaVice President of Hardware
Vice President of Engineering @ Working with an awesome team to build a new tech company which is developing a new line of wearable devices and a dynamic platform for the mass market which will create an entirely new category in consumer electronics. From November 2015 to Present (2 months) San Francisco Bay AreaVice President of Hardware Engineering and Operations @ • Responsible for the overall hardware design and manufacturing operations for all current and next generation Lytro light-field imaging products. This includes managing all aspects of mechanical, electrical, optical, and low level firmware engineering as well as supply chain and manufacturing operations. Lytro is the leader in light-field enabled imaging devices that include consumer cameras, light-field video cameras for cinematography, and VR (virtual reality) imaging capture devices.
• Key member of the Lytro executive staff actively participating in setting the strategic direction for the current and future Lytro business.
• Currently manage design teams in Mountain View, Chicago, Taipei, and manufacturing teams in Suzhou and Huangpu, China. The team currently consists of 20 people (down from 45 at the peak) comprised of engineers, engineering program managers, and supporting roles.
• Responsible for all aspects of the engineering prototype and production manufacturing budgets. Work in close cooperation with our sales team to accurately forecast and manage product supply globally to our direct customers and distribution partners.
• Routinely travel to Asia to manage our manufacturing partners and key component suppliers. This includes managing all the executive relationships and supplier agreements for all our strategic suppliers and contract manufacturing partners.
• Deeply involved in defining the next generation light-field imaging hardware architectures. Projects include developing very high megapixel custom image sensors, custom FPGAs for light-field data acceleration, development of custom lenses and optics, and implementing the latest, most powerful Qualcomm chipset utilizing an Android operating system.
• Actively managing the “on device” low level firmware and BSP development schedule to optimize the internal resources, the capabilities of our JDM partner, and external third parties as needed. From April 2014 to November 2015 (1 year 8 months) Director of Hardware Design @ • Joined the Lytro team during the early concept phase of the Lytro Illum which is our current flagship consumer camera. Led all aspects of the hardware design from the industrial design phase through NPI (New Product Introduction) and into mass production.
• Recruited and managed a team of engineers and program managers, both internal and overseas, to develop the light-field Lytro Illum camera. Specific responsibilities included implementing the camera electrical chipset, image sensor, lens control system, LCD display, and overall electrical system architecture of the product.
• Managed the overall mechanical product design including the detailed part design, vendor selection, reliability testing and qualification prior to mass production. This also included the early packaging studies evaluating and utilizing an external design studio for the industrial design of the product.
• Detailed involvement in the optical design including the sensor, main lens, micro lens array, and establishing the optimal optical component supply chain for yield, cost, and performance.
• Built the overall product schedule and defined key KPIs and milestones.
• Managed any required sustaining activity on the current generation shipping Lytro camera. From October 2012 to May 2014 (1 year 8 months) Manager of Hardware Engineering @ • Hired into RIM to open and build the product design center in Chicago in January of 2008. Responsibilities included: attracting, interviewing, and hiring key engineering talent, as well as developing the test laboratories including specifying the capital equipment and test systems. Grew the headcount of the design center to over 85 individuals with $40 million invested in capital equipment. While continuing to grow the office, this design center designed and shipped multiple BlackBerry products including the BlackBerry Pearl 8220, BlackBerry Curve 9350/9360/9370, and BlackBerry Q5.
• Directed a team of 25 engineers responsible for the detailed electrical design including all baseband and RF circuitry as well as the antenna system design for CDMA, GSM, UMTS, and LTE products. This included Qualcomm, TI OMAP, and Marvell based designs utilizing the latest technology including LTE, WIFI, Bluetooth, GPS, LCDs, touch screens, high resolution cameras, HDMI, augmented reality sensors, audio transducers, multimode PAs, and tunable RF matching networks.
• Led the electrical architecture development and product implementation of NFC (Near Field Communications) hardware into the RIM portfolio. The BlackBerry Bold 9900 and BlackBerry Curve 9360 achieved the world’s first SIM-based MasterCard and Visa PayPass Handset Certification.
• Active participation in future silicon and architecture roadmap discussions with the RIM architecture teams and suppliers. Also spent significant work defining RIM design processes and best practices for working with OEM, ODM partners and growing internal design centers.
• Member of RIM Patent Review Committee. From January 2008 to October 2012 (4 years 10 months) Product Line Manager 3GSM @ • Product lead responsible for creating and managing the feature set, development schedule, and business case for one of Motorola’s feature phones.
• Responsible for product feature definition and product bill of material cost.
• Led a small product management team responsible for saving approximately $15M in prototype costs by platforming a tier of products to penetrate multiple product prices points with a single hardware product design.
• Responsible for providing schedules and facilitating product feature decisions to the major regions and key carriers. From October 2007 to January 2008 (4 months) Engineering Manager @ • Engineering lead responsible for the detailed electrical design of multiple 3G mobile cell phones and accessories.
• Led engineering teams that designed and tested the hardware of high tier 3G mobile handsets representing more than $300M in revenue.
• Evaluated new technologies and architectures for new product development including baseband processors, GPUs, embedded memory, high mega pixel imagers, displays, and RF chipsets.
• Responsible for introduction of new products into the Motorola mass production manufacturing sites as well as our contract manufacturing partners.
• Provided customer support and was responsible for communicating status of customer requirements, KPIs, and overall program status throughout the design cycle of multiple programs.
• Worked with supply chain to evaluate and select high quality, low cost components.
• Directly involved in shipping many 3G UMTS products such as A820, A825, A1000, E1000, e770v, V3x, V3xx, and MotoRazr Maxx V6. From June 1997 to October 2007 (10 years 5 months) Electrical Engineer @ • Engineer responsible for the detailed design of multiple aspects of the Iridium products.
• Designed and tested the electrical hardware for the Motorola Iridium 9500 and 9505 handsets.
• Converted the 9500 portable handset to a fixed mount L-band transceiver design for implementation on aircraft and ocean going vessels.
• Provided technical customer support implementing the Iridium L-band transceiver to VAMs (value added manufacturers).
• Provided support of initial satellite network and handset testing at Motorola facilities in Chandler, AZ. From June 1997 to April 2000 (2 years 11 months) Electrical Engineer @ • Started as co-op engineer. Worked continuously through all co-op terms while finishing the course work to fund my undergraduate BSEE degree.
• Designed software drivers for variable speed induction motor controls utilizing assembly language on a Microchip uP and Visual Basic for the host computer GUI interface.
• Experience with power electronics and variable speed motor controls. From June 1994 to May 1997 (3 years)
MBA, Strategy, Organizational Management @ The University of Chicago - Booth School of Business From 2001 to 2005 BSEE, Electrical Engineering @ Marquette University From 1992 to 1997 Todd Roesler is skilled in: R&D, Hardware, Wireless, Cellular, Cross-functional Team Leadership
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