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Ravi Adimula

Packaging Engineer

Sr Lead Mechanical Engineer at GE Aviation

Phoenix, Arizona Area

Section title

Ravi Adimula's Email Addresses & Phone Numbers

Ravi Adimula's Work Experience

Allegro Microsystems

Packaging Engineer

October 2000 to June 2006

GE Aviation

Sr Lead Mechanical Engineer

Jacksonville, Florida Area

Electronic Systems Center, Goodrich

Sr Mechanical Engineer

February 2011 to October 2014

Phoenix, Arizona Area

Ravi Adimula's Education

University of Florida

PhD, Mechanical Engg

1996 to 2000

University of California, Los Angeles

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52% Left Brained
48% Right Brained

Ravi Adimula's Estimated Salary Range

About Ravi Adimula's Current Company

Allegro Microsystems

Frequently Asked Questions about Ravi Adimula

What company does Ravi Adimula work for?

Ravi Adimula works for Allegro Microsystems

What is Ravi Adimula's role at Allegro Microsystems?

Ravi Adimula is Packaging Engineer

What is Ravi Adimula's personal email address?

Ravi Adimula's personal email address is r****[email protected]

What is Ravi Adimula's business email address?

Ravi Adimula's business email addresses are not available

What is Ravi Adimula's Phone Number?

Ravi Adimula's phone (602) ***-*257

What industry does Ravi Adimula work in?

Ravi Adimula works in the Semiconductors industry.

About Ravi Adimula

📖 Summary

Packaging Engineer @ Allegro Microsystems From October 2000 to June 2006 (5 years 9 months) Sr Lead Mechanical Engineer @ GE Aviation Work focusing on mechanical package design and development of digital electronic modules and exciters for aerospace and transportation business segment.Lead mechanical design activity. Design module level and package level for high reliability and high temperature environment. Design for manufacturability.Thermal & vibration analysis using ANSYS, Flotherm & IcepakTesting per industry standards.Project management activity Jacksonville, Florida AreaSr Mechanical Engineer @ Electronic Systems Center, Goodrich Design and development of Electronic modules packaging for Break controls, Actuator controls and Power conditioning modules for aerospace application.Provide in depth analysis-thermal and vibrationMaterial selectionsDesign for manufacturingProject management From February 2011 to October 2014 (3 years 9 months) Phoenix, Arizona AreaSr. Package Design Engineer @ Micron Technology Work focused on chip level packaging of Flash memory products.Major contribution towards reducing the package thickness & multi die packaging & PoP (package on package) designMaterial selection and analysis for reducing warpage issues associated with packagesIntroduced Copper wire bond for product line.Worked on lead frame based as well as BGA substrate based packages. Contributed to mold materials and die attach materials development. From January 2008 to February 2011 (3 years 2 months) Phoenix, Arizona AreaSr.Mechanical Engineer @ International Rectifier Sr.Mechanical Design engineer working on defense and aerospace electronics.Work focused on design and development of high power modules (IGBT , SCR and Diode module) for high reliability defense and civilian application.Design , develop and co-ordinate with vendors on high reliability ceramic packages. From June 2006 to December 2007 (1 year 7 months) Greater Boston Area

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In a nutshell

Ravi Adimula's Personality Type

Introversion (I), Sensing (S), Thinking (T), Perceiving (P)

Average Tenure

3 year(s), 6 month(s)

Ravi Adimula's Willingness to Change Jobs



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