Ralic Lo's Email Addresses & Phone Numbers

• Specialized in semiconductor package engineering, and flexible printed circuit board materials with 7 year work experience • High-level problem-solving and decision-making to implement appropriate strategies for product and system improvements • Proven strength in utilizing electrical, thermal, mechanical engineering knowledge from material to process, and integrating cross-functional and professional efforts for team success • Oversee complex,...

• Specialized in semiconductor package engineering, and flexible printed circuit board materials with 7 year work experience • High-level problem-solving and decision-making to implement appropriate strategies for product and system improvements • Proven strength in utilizing electrical, thermal, mechanical engineering knowledge from material to process, and integrating cross-functional and professional efforts for team success • Oversee complex, multiphase engineering projects as a proactive manager who always try the best to meet the project objective and help enhance skills of the team • Resourceful and professional network in engineering and business field to bring best practice into organization • Committed to success and work professionally with multi-discipline internal or external teamsEngineering Program Manager @ • Successfully initialized propietary engineering development project with key customers • Presented technology roadmap of flexible electronics materials for rigid, rigid-flex and flexible PCB • Conferred with management, production, engineering and marketing team to define project scope and timeline as well as business flow • Proactive efforts in patent, competitor study and new technology market for new material R&D • Managed coordination and integration of technical activities in engineering projects • Excelled design proposal for better manufacturability of customized product From July 2014 to July 2015 (1 year 1 month) Application Engineer @ • Managed new product projects for 4 key customers and provided engineering support in 6 factories • Co-worked with sales and engineering team efficiently to provide best package solutions, increasing key customer YOY revenue 70M(270%) in 2013 • Took responsibility in technology development and achieved first production records in ASE group: 1) First flip chip to wafer technology for MEMS based devices with detailed thermal and package structure review, which becomes a main NPI driver afterward for various MEMS customer 2) First 9um+ thick plated Cu RDL technology for miniaturization of power devices, including production monitoring and baseline spec preparation, which becomes a standard process flow and main NPI driver for ASE • Reviewed new product design and suggested material selection based on application • Analyzed product failure data and laboratory results to determine causes of problems and develop better solution From August 2011 to July 2014 (3 years) Senior Engineer @ • Oversea promotion of copper wire bonding to various US customers as technology revolution • Identified opportunities and implemented quality control activities to improve production yield • Direct supervised 3 engineers and led technicians to support project activities • Integrated existing process controls for new product manufacturing From October 2010 to August 2011 (11 months) Engineer @ • Effectively supported to qualify 1st 2.0mil Cu wire process in SOIC for power management application, which brought finer wire development later and created a revolutionary cost saving opportunities for ASE • Successfully applied 6 Sigma and logical/design thinking from 8D methodology to solve field return and product quality issues. • Introduced new projects for more than 10 customers, learning experiences and knowledge in various package types including BGA / QFN / QFP / SOIC • Provided data-driven insights to senior managers to improve R&D experiment design by using Minitab; contributed in FMEA revision for manufacturing risk & feasibility assessment From October 2007 to October 2010 (3 years 1 month) Bachelor of Science (B.S.), Chemical Engineering, 3.11/4.0, 146 credits @ National Tsing Hua University From 1998 to 2002 Master of Science (M.S.), Chemical Engineering, 3.83/4.0, 35 credits @ National Chung Hsing University From 2005 to 2007 Master of Business Administration (M.B.A.) @ California University of Managment and Technology From 2013 to 2014 Master of Computer Science, Computer Science @ Northwestern Polytechnic University From 2014 to 2016 Elementary ERP Planner Certificate - 51 hours @ National Central University (Chinese Enterprise Resource Planning Society) From 2009 to 2009 Master credit from extened education (3), Industrial Engineering, 4.0/4.0 @ Chung Yuan Christian University From 2007 to 2007 Ralic Lo is skilled in: Semiconductors, IC, R&D, Manufacturing, Product Development, Six Sigma, Project Management, Materials Science, Engineering Management, Matlab, Engineering, Design of Experiments, Minitab, GNU Octave, Hadoop