Heidi Ho's Email & Phone Number
IC Packaging Engineer
Heidi Ho Email Addresses
Heidi Ho Phone Numbers
Heidi Ho's Work Experience
Apple
IC Packaging Engineer
Show more
Show less
Heidi Ho's Education
National Central University, Taiwan
B.S., Mechanical Engineering
April 2024 to April 2024
University of California, San Diego
M.S., Mechanical Engineering
April 2024 to April 2024
Show more
Show less
Frequently Asked Questions about Heidi Ho
What is Heidi Ho email address?
Email Heidi Ho at [email protected], [email protected], [email protected] and [email protected]. This email is the most updated Heidi Ho's email found in 2024.
How to contact Heidi Ho?
To contact Heidi Ho send an email at [email protected], [email protected], [email protected] or [email protected].
What company does Heidi Ho work for?
Heidi Ho works for Apple
What is Heidi Ho's role at Apple?
Heidi Ho is IC Packaging Engineer
What is Heidi Ho's Phone Number?
Heidi Ho's phone (**) *** *** 413
What industry does Heidi Ho work in?
Heidi Ho works in the Electrical/Electronic Manufacturing industry.
Heidi Ho's Professional Skills Radar Chart
Based on our findings, Heidi Ho is ...
What's on Heidi Ho's mind?
Based on our findings, Heidi Ho is ...
Heidi Ho's Estimated Salary Range
Heidi Ho Email Addresses
Heidi Ho Phone Numbers
Find emails and phone numbers for 300M professionals.
Search by name, job titles, seniority, skills, location, company name, industry, company size, revenue, and other 20+ data points to reach the right people you need. Get triple-verified contact details in one-click.In a nutshell
Heidi Ho's Personality Type
Introversion (I), Sensing (S), Thinking (T), Perceiving (P)
Average Tenure
2 year(s), 0 month(s)
Heidi Ho's Willingness to Change Jobs
Unlikely
Likely
Open to opportunity?
There's 85% chance that Heidi Ho is seeking for new opportunities
People you may be
interested in
IC Packaging Engineer at Apple at University of California, Los Angeles
iPhone Signal Integrity Engineer at Apple at Apple
Senior IP Verification Engineer at Intel Corporation at Intel Corporation
IC Packaging Engineer at Apple at Apple
Director of IC Packaging Integration/Design & Simulation at Amkor Technology, Inc.
Principal Engineer at Western Digital at Western Digital
Engineer at Apple at Apple
Microelectronic packaging in the field of CMOS imager sensor, LED, NAND, DRAM, 3D TSV, Optical sensors, and MEMS sensors at Maxim Integrated
IC Packaging at Apple at Apple
Product Design Engineer at Apple at Apple
IC packaging engineer at Intel Corporation at Intel Corporation
Packaging Technologist at Apple at Apple
Heidi Ho's Social Media Links
/in/heidisyho /company/apple /school/ucsandiego/