Specialties: New product development, Mechanical part design for Injection Molding, Two-shot plastic design, Decorative painting, Pad printing, High volume manufacturing. PCBA and Flex design, Machined parts, Metal stamping, Zinc casting. Sheet metal EMI shielding, antenna design, Engineering drawings and documents. DFM, DFA, Six Sigma, Tolerance Analysis(stack-up) Design Verification Testing: Shock, Vibration, Thermal, Humidity Test & Analysis. Project Planning: Gantt chart, Stage-gate CAD: Pro Engineer Wildfire 5.0, Solidworks 2013 CAE: Pro/Mechanica, Plastic Advisor, Simulation Xpress(FEA) CFD: Solidworks Flow Simulation PLM/PDM: Windchill, PDMLink, Agile, ARAS Microsoft Office Suite, Project, Visio, Dynamics NAV

Manager - Field Applications Engineering @ From June 2013 to Present (2 years 7 months) Greater Chicago AreaDirector @ • Redesigned the Sterilizable tag incorporating a unique approach to housing and gasket design; in addition to, using Paralyne conformal coating to ensure product survives multiple sterilizing cycles at extreme temperatures and pressures. U.S. Patent 8,600,374 Issued. • Redesigned the Patient & Wearable design converting it from a Liquid Injection Molding Silicone (LIM) concept to a dual shot injection molded polycarbonate design approach which saved over $5 on product cost. From February 2010 to 2013 (3 years) Greater San Diego AreaDirector of Mechanical Engineering @ • Lead highly skilled mechanical teams, both domestic and foreign, through product development cycle. Responsible for making decisions critical to the program, and update Product Management, Operations, and Quality Assurance as the mechanical engineering point of contact. • Design and develop a variety of data modem form factors, including bar, slide, swivel USB devices, Express Card, PCMCIA, mini-PCI module and fixed mobile convergence (MiFi©). • Researched, developed the architecture, and implemented a Product Lifecycle Management (PLM) System – Windchill 9.1 at Novatel Wireless to handle all documentation, schedule and Engineering Change Notices electronically both internally and with our Contract Manufacturers and Suppliers. From October 2007 to February 2010 (2 years 5 months) Greater San Diego AreaSr Mechanical Engineer @ • Designed/project managed the Expedite embedded module derived from the C201 modem. Developed die cast outer case solution to provide both mechanical structure and shielding to the PCB assembly. • Designed and launched the dual band PCMCIA V620 1xEVDO data modem. The product featured a Ultem 6000 plastic carrier and FPC antenna solution which could be SMT reflowed. • Designed and launched the dual band EV620 EVDO embedded module for Dell, Toshiba and Panasonic laptops. • Architected the design and launched the first EVDO data modem in the new Express Card form factor for Dell and Verizon. The product incorporated both a carrier flex diversity antenna, hinged primary antenna and Gore vacuum metalized shielding solution. • Architected the design and launched the MC950D HSDPA miniaturized USB modem. To achieve the small size and address thermal issues the product utilized insert molding technology, Liquid Metal™ thin wall casting and thermal management gap fillers. U.S. Patents 7,751,204 and 8,018,734 issued. • Architected the design and launched the MC727 EVDO miniaturized USB modem. To achieve the small size and add micro-SD card reader into the product, a new approach to mounting parts on shielding was developed. U.S. Patent 7,636,245 and 8,009,441 issued. • Engineering Project Manager for the MC1000 USB world data modem utilizing the Qualcomm Gobi module platform. From December 2000 to October 2007 (6 years 11 months) Greater San Diego AreaMechanical Engineer @ • Utilized Pro/Engineer part, assembly, surface, and detail drawing modules in design and modeling of plastic phone housings, LCD modules, keypads, vibration motors, switches, jacks, and connectors. • Developed unique approach to charger base design to accommodate varying capacity batteries for Timeport brand GSM cell phone. Patent 6,049,192 issued. From June 1996 to December 2000 (4 years 7 months) Greater Chicago AreaManufacturing Line Manager @ Responsible for high volume production of both surface mount technology (SMT) PCBA's and model assembly of cell phones. From December 1992 to June 1996 (3 years 7 months) Greater Chicago AreaElectronic Maintenance Officer/Electrical Officer @ Managed team of over 40 electrical technicians that were responsible for maintaining over 800 pieces of electrical equipment: generators, motors, servos and lighting. Managed team of 5 electronic technicians that were responsible for all communications, cryptology and navigation equipment. From December 1986 to November 1991 (5 years) Japan

BSNE, Nuclear Engineering @ Purdue University From 1982 to 1986 Bob Hertlein is skilled in: Product Launch, Wireless, Product Development, Product Lifecycle Management, Engineering Management, Mechanical Product Design, Pro Engineer, Windchill 9.1, Mobile Devices, Design for Manufacturing, Telecommunications, Manufacturing, Mechanical Engineering, Supply Chain Management, Cross-functional Team Leadership